| 摘要 |
PROBLEM TO BE SOLVED: To realize an automatic wiring shaping method which can automatically shape a wiring designed in an arbitrary direction to one that has a specified angle to a prescribed reference line on a board of a semiconductor package. SOLUTION: The automatic wiring shaping method has a step for providing a pair of concentric octagons that have a side parallel to a prescribed reference line; a step for sequentially executing processing that a wiring which has a line passing between adjacent viaholes is temporarily arranged so that the line is placed on either side of the octagon placed for a viahole which exists at the nearest position to the line for every wiring so as to secure a clearance to a wiring that processing is completed immediately before it; and a step for sequentially executing processing to further correct wiring positions for temporarily arranged wirings which are not secured with a clearance to other adjacent temporarily arranged wirings so as to secure a clearance to the other adjacent temporarily arranged wirings in the reverse order to the execution order for each wiring of temporarily arrangement processing. COPYRIGHT: (C)2008,JPO&INPIT |
