| 摘要 |
PROBLEM TO BE SOLVED: To prevent deformation or position deviation caused by a thermal stress of a molding resin of a circuit board molded on a sensor case without complicating an assembly process of the sensor case. SOLUTION: The circuit board 5 is disposed on the center part in an internal space of the sensor case 6, and the internal space is filled with the molding resin A, and each thickness of the molding resin A with which the surface side and the back side of the circuit board 5 are filled is equalized, to thereby balance each magnitude of the thermal stress generated in the molding resin A with which the surface side and the back side of the circuit board 5 are filled. Hereby, deformation or position deviation of the circuit board 5 caused by the thermal stress of the molding resin A is prevented without complicating the assembly process of the sensor case 6. COPYRIGHT: (C)2008,JPO&INPIT
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