发明名称 METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTEGRATED CIRCUITS
摘要 Methods and apparatus provide a sensor having an integrated component coupled to a leadframe. In one embodiment, a sensor includes external leads on an opposite side of a die from the integrated component. In another embodiment, a leadframe includes a slot to reduce eddy currents.
申请公布号 US2008013298(A1) 申请公布日期 2008.01.17
申请号 US20060457626 申请日期 2006.07.14
申请人 发明人 SHARMA NIRMAL;ARARAO VIRGIL;MAGPANTAY LEONARDO T.;ENGEL RAYMOND W.;TAYLOR WILLIAM P.;DOOGUE KIRSTEN;GAGNON JAY
分类号 H05K5/02 主分类号 H05K5/02
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