<p>A wafer comprises a multi-layer structure (100). The multilayer structure (100) includes a first device structure neighbouring an area (106) for receiving alignment markers. A plurality of alignment markers (110) extend into the multilayer structure (100) and are located within the area for receiving alignment markers. The plurality of alignment markers (110) is arranged to prevent propagation of a crack, when occurring, beyond a material-dependent critical length in a part of the multi-layer structure (100) corresponding to the area (106) for receiving the alignment structure. The material-dependent critical length is associated with the part of the multi-layer structure (100).</p>
