METHOD FOR WORKING OBJECT TO BE WORKED

摘要

A method for processing a workpiece to be processed is provided to realize sufficient adhesive property during transfer or dicing of a workpiece such as a semiconductor wafer while realizing a low peel force characteristics upon the pick up of workpiece chips. A method for processing a workpiece to be processed comprises the steps of: bonding the workpiece fixed to a support to a dicing adhesive sheet(10) by way of a double-side adhesive sheet having a thermally removable or radiation curable adhesive layer; heating or irradiating the double-side adhesive sheet to remove the double-side adhesive sheet from the workpiece; dicing the workpiece having the dicing adhesive sheet to form workpiece chips; and picking up the workpiece chips, wherein the dicing adhesive sheet comprises at least one adhesive layer(12) on a substrate film(11), and the adhesive layer comprises an acrylic polymer containing at least 5 wt% of a monomer having a pendant alkoxyl group and has a thickness of 1-50 micrometers.