ORGANIC INORGANIC PHOTOSENSITIVE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive transparent resin composition having 260°C reflow heat resistance useful for producing a solid image pickup element or an electronic part-integrated type product requiring a solder reflow step at 260°C and having excellent characteristics even of adhesiveness, elongation and temperature impact resistance other than the heat resistance and to provide a micro-plastic lens or an optical element for a liquid crystal polarizing plate using the photosensitive transparent resin composition.

SOLUTION: The photosensitive transparent resin composition comprises a resin obtained by carrying polycondensation of compounds containing organosilanes composed of three elements of a specific combination in the presence of a catalyst at 40 to ≤150°C temperature for 0.1-10 h. A method for producing the micro-plastic lens or optical element for the liquid crystal polarizing plate using the composition is provided.

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