| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wired circuit board which can remove electrostatic charge efficiently, moreover can prevent the short-circuiting of a conductor pattern securely. <P>SOLUTION: On a metal support substrate 2, a base insulation layer 3 is formed so as to form a plurality of base openings 11 corresponding to a plurality of interconnections 9 on the base insulation layer 3. A conductor pattern 4 having the plurality of interconnections 9, and a plurality of ground connection portions 7 are formed simultaneously in the each base opening portion 11. On the base insulation layer 3, each semiconductive layer 5 is formed so as to cover the each interconnection 9 and the each grounding portion 7 so that the each may become independent corresponding to the each interconnection 9. On the base insulation layer 3, a cover insulation layer 6 is formed so as to cover the each interconnection 9 exposed from the each semiconductive layer 5 and the base insulation layer 3. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
