| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for mounting a semiconductor and a mounting structure therefor which improve the yield of flip chip mounting of a semiconductor component and which can yield high reliability. SOLUTION: The substrate for mounting semiconductor is provided with a via electrode 8 for interlayer connection in the substrate 3 under an electrode land 4, and a projection 9 is formed on the surface of the electrode land 4 by the via electrode 8. The variety of heights of solder bumps 7 of the semiconductor component 1 is absorbed, mounting with a high yield is available, and, on the other hand, the amount of used solder can be reduced, thereby permitting the prevention of outflow of the solder upon remelting of the same. COPYRIGHT: (C)2008,JPO&INPIT
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