The invention relates to a lamp socket consisting at least partially of a plastic composition having a through plane thermal conductivity of at least 0.5 W/m.K. The plastic composition may comprise a thermoplastic polymer and a thermally conductive filler and/or a thermally conductive fibrous material. For example, the plastic composition may comprise a semicrystalline polyamide having a melting point of at least 200°C, glass fibres and boron nitride. The tendency to fogging is reduced.
申请公布号
WO2008006443(A1)
申请公布日期
2008.01.17
申请号
WO2007EP05344
申请日期
2007.06.18
申请人
DSM IP ASSETS B.V.;JANSSEN, ROBERT, HENDRIK, CATHARINA;VAN DIJK, HANS, KLAAS
发明人
JANSSEN, ROBERT, HENDRIK, CATHARINA;VAN DIJK, HANS, KLAAS