| 摘要 |
<p>Edge feature measurement systems and methods used to characterize one or more features of an article, such as a semiconductor wafer. Characterized features include resist layer outer boundaries proximate an edge of a wafer, as well as other wafer features proximate the wafer edge as desired. In some embodiments, a relative distance from an edge of a wafer to a resist layer edge can be found via an imaging system, for example where resist was removed about a circumference of a semiconductor wafer. In other embodiments, a center of a wafer (or a center of one or more resist layers) is found and, where desired, a relative offset between the wafer center and centers of the one or more resist layers.</p> |
