| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an improved optoelectronic device comprising a light-emitting semiconductor and an encapsulant. <P>SOLUTION: The optoelectronic device comprises the light-emitting semiconductor and the encapsulant is made from an encapsulant formulation comprising an epoxy isocyanurate, an optional epoxy hydantoin, and a curing agent. In the device, the encapsulant has high UV and heat stability, improved curability, e.g. the curing ability at B- or C-stage, good transparency and higher glass transition temperature (Tg). The method of preparing the optoelectronic device includes (i) a step for preparing the light-emitting semiconductor, and (ii) a step for encapsulating the light-emitting semiconductor with the encapsulant. <P>COPYRIGHT: (C)2008,JPO&INPIT |
