| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection device of a semiconductor device capable of inspecting a high-frequency characteristic without being brought into contact with an external electrode of a semiconductor device other than the semiconductor device which is an inspection operation object, even in the state where a matrix arrangement when manufacturing arrangement of the semiconductor device in a wafer shape is maintained, or in the state where the matrix arrangement when manufacturing it in an assembled substrate shape is maintained. SOLUTION: A vacuum suction hole 12 is provided in an inspection circuit board 9, and the air is sucked from the vacuum suction hole 12, and the interval between the inspection circuit board 9 and the inspection device 1 is depressurized, to thereby fix the interval between the inspection circuit board 9 and the inspection device 1 without using a fastening element. Consequently, the high-frequency characteristic can be inspected without being brought into contact with the external electrode of the semiconductor device other than the semiconductor device which is the inspection operation object, even in the state where the matrix arrangement when manufacturing arrangement of the semiconductor device 2 in the wafer shape is maintained, or in the state where the matrix arrangement when manufacturing it in the assembled substrate shape is maintained. COPYRIGHT: (C)2008,JPO&INPIT
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