Electronic assembly and manufacturing method having a reduced need for wire bonds

摘要

An electronics assembly having a reduced need for wire bonds is provided. The electronics assembly includes a substrate having upper and lower surfaces. An electronic circuit device having conducting pads is attached to the upper surface of the substrate such that the conducting pads face the upper surface of the substrate. The lower surface of the substrate includes an exposed conducting feature. An electrically conducting interconnect in the substrate electrically couples the exposed conducting feature to the conducting pads of the electronic circuit device. The exposed conducting feature of the substrate is electrically coupled to a leadframe finger of a leadframe by solder, providing a conducting path between the leadframe finger and the electronic circuit device.