发明名称 One-time-programmable anti-fuse formed using damascene process
摘要 A semiconductor structure includes a semiconductor substrate, a power source, and a stacked structure over the semiconductor substrate and coupled to the power source. The stacked structure includes a bottom electrode, a top electrode, and an insulation layer between the top electrode and the bottom electrode, wherein the insulation layer has a breakdown voltage lower than a pre-determined write voltage provided by the power source and higher than a pre-determined read voltage provided by the power source.
申请公布号 US2008012138(A1) 申请公布日期 2008.01.17
申请号 US20060487849 申请日期 2006.07.17
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 WANG MING-TSONG;ONG TONG-CHERN
分类号 H01L23/48;H01L23/52;H01L29/40 主分类号 H01L23/48
代理机构 代理人
主权项
地址
您可能感兴趣的专利