DESIGN METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT, DESIGN DEVICE, SEMICONDUCTOR INTEGRATED CIRCUIT SYSTEM, SEMICONDUCTOR INTEGRATED CIRCUIT MOUNTING SUBSTRATE, PACKAGE, AND SEMICONDUCTOR INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a method for designing a semiconductor integrated circuit system excelling in thermal characteristics while reducing undesired radiation by designing a semiconductor integrated circuit with good work efficiency even in achieving a large scale and high integration of an LSI.

SOLUTION: Design flow reverse to a conventional method is achieved in this method, wherein a mounting board such as a printed board is designed first, and based on the designed result of the mounting board, a package substrate for mounting the LSI is designed, and then the layout design of the LSI mounted on the package substrate is performed.

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