| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent malfunction of a driving IC chip and a recording element mounted on a flexible flat cable, and to mount circuit elements for the prevention on the flexible flat cable without increasing manufacturing processes greatly. <P>SOLUTION: Bumps 92 for electrically joining to an actuator 11 are formed on a surface joined to the actuator 11 of the flexible flat cable 12, and also the circuit elements 80 are mounted on the surface. The driving IC chip 12c for driving the actuator 11 is mounted on a surface of the opposite side thereof. Terminal electrodes connected with the circuit elements 80 and a terminal electrode connected with the actuator 11 at the flexible flat cable 12 are exposed to the same surface side. A solder paste 91 is printed and formed on the electrodes. Formation of the bumps 92 is also carried out simultaneously with connection of the circuit elements 80 and terminal electrodes by heating the solder. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
