| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device and manufacturing equipment of the semiconductor device, wherein a productivity can be more enhanced than conventionally. SOLUTION: When a plurality of wafers for products are simultaneously filmed by use of a batch-type vertical hot wall LPCVD device, in an inside of a boat 2 for holding a plurality of wafers by laminating them to a direction perpendicular to the surface of the wafer, the plurality of wafers for products are loaded in a product processing region where a temperature is uniform. In a state that a side dummy wafer 1b for holding a temperature of the product processing region uniform is loaded in a region adjacent to the product processing region, the plurality of wafers are simultaneously filmed for products. Then, the wafers for products are exchanged by the other wafers for products. But, the side dummy wafer 1b is not taken out from the boat 2, and the side dummy wafer 1b is moved in the boat 2 so that the boat 2 is taken off from the side dummy wafer 1b. Then, the side dummy wafer 1b is again placed on the boat 2. COPYRIGHT: (C)2008,JPO&INPIT
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