发明名称 MANUFACTURING METHOD OF PLATED SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a plated substrate for forming a fine pattern with excellent accuracy, and its manufacturing method. SOLUTION: The manufacturing method of a plated substrate 100 is a method for manufacturing the plated substrate by an electroless plating method, which includes a step of providing a catalyst layer 32 in an area other than a predetermined pattern on a substrate 10, a step of providing a first metal layer 34 of a predetermined pattern by depositing a first metal on the substrate by immersing the substrate in a first electroless plating liquid containing the first metal, and a step of providing a second metal layer 37 by depositing a second metal on an upper surface of the first metal layer by immersing the substrate in a second electroless plating liquid containing the second metal. The ionization tendency of the first metal is higher than that of the second metal. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008007840(A) 申请公布日期 2008.01.17
申请号 JP20060181567 申请日期 2006.06.30
申请人 SEIKO EPSON CORP 发明人 KIMURA SATOSHI;KIJIMA TAKESHI;FURUHATA HIDEMICHI;KANEDA TOSHIHIKO
分类号 C23C18/18;C23C18/52;H05K3/18;H05K3/24;H05K3/26 主分类号 C23C18/18
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