SYSTEM AND METHOD OF ATTENUATING ELECTROMAGNETIC INTERFERENCE WITH A GROUNDED TOP FILM

摘要

A plastic integrated circuit package often includes one or more integrated circuit elements that are sensitive to outside electromagnetic fields and also may generate electromagnetic fields that may interfere with other circuits outside of the package. The package (50) herein has a top metal film (51) to attenuate such electromagnetic fields, using a wire loop (52) extending through the encapsulating compound (14) to the metal film on top of encapsulating compound to provide electrical connection between top EMI film and end- and-ground junctions (58) at grounds on die (24) or on end-and-ground junctions at grounds on substrate (16).