INTEGRATED CIRCUIT MOUNT SYSTEM WITH SOLDER MASK PAD
摘要
An integrated circuit mount system (500) includes an integrated circuit (108), a solder mask (202) for the integrated circuit (108), and a solder mask pad (102) on the substrate (104) with the solder mask (202).
申请公布号
WO2008008798(A1)
申请公布日期
2008.01.17
申请号
WO2007US73186
申请日期
2007.07.10
申请人
STATS CHIPPAC LTD.;KIM, KYUNG MOON;KIM, KYUNGOE;CHOI, HAENGCHEOL;PENDSE, RAJENDRA D.
发明人
KIM, KYUNG MOON;KIM, KYUNGOE;CHOI, HAENGCHEOL;PENDSE, RAJENDRA D.
