A semiconductor package fabrication method in which drop on demand deposition of a drop on demand depositable material is used to prepare one component or a plurality of components of a semiconductor package or multi-chip module.
申请公布号
DE112006000505(T5)
申请公布日期
2008.01.17
申请号
DE20061100505T
申请日期
2006.03.06
申请人
INTERNATIONAL RECTIFIER CORP.
发明人
STANDING, MARTIN;PAVIER, MARK;CLARKE, ROBERT J.;SAWLE, ANDREW;MCCARTNEY, KENNETH
