| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing method capable of highly accurately performing dicing with a high yield when a semiconductor substrate is processed by dicing such as a silicon substrate. SOLUTION: A desired element region is formed on a semiconductor wafer. Then, laser beam drawing is performed three times, while changing the drawing pattern each time by 120°rotation of it, in performing division into individual semiconductor chips. The dicing is performed to obtain regular hexagons, so that the semiconductor chips are formed without waste and with a high yield. COPYRIGHT: (C)2008,JPO&INPIT |
