| 摘要 |
PROBLEM TO BE SOLVED: To provide a removing method of a resist pattern in which the resist pattern where a cured layer is formed on a surface, can completely be removed by a processing using supercritical fluid. SOLUTION: The method is to remove the resist pattern 101 where the surface is covered with the cured layer A from a substrate 100. In a first process, the resist component 101a covered with the cured layer A is not dissolved, but a processing is performed for using supercritical fluid containing conversion agent having an operation for weakening adhesiveness of the cured layer A and the substrate 100, in a part where the cured layer A is brought into contact with the substrate 100. In a second process, a process is performed for using supercritical fluid containing organic solvent dissolving the resist component 101a. Thus, the cured layer A is lifted off and removed from the substrate 100. COPYRIGHT: (C)2008,JPO&INPIT |
