LIQUID STATE EPOXY RESIN FOR CHIP-ON FILM AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a liquid state epoxy resin for a COF (chip-on film) capable of inhibiting the reduction of insulation property caused by a migration occurring under a high temperature and high humidity and especially becoming a problem in the COF type semiconductor device having a narrow circuit width and circuit interval and equipped with a circuit driven by a high electric voltage such as a FPD (flat panel display)-driving package. SOLUTION: This liquid state epoxy resin for the COF used as a sealing material 5 for sealing a gap formed between a semiconductor chip 2 and a FPC (flexible printed circuit) after loading a semiconductor chip 2 in a semiconductor-loading range 3c in the circuit formed on the FPC 3 is provided by containing (A) a specific epoxy resin, (B) a specific acid anhydride-based curing agent and (C) a curing accelerator. COPYRIGHT: (C)2008,JPO&INPIT