发明名称 Direct drive technology chip package
摘要 A chip package that can be directly used by users, on one end of the chip package is provided a plurality of metal terminals that can be connected to electronic equipment directly, such as computer. A vertical hole in communication with a chip substrate or a protection circuit board inside the chip package can be formed on the chip package, and by inserting resistors with different resistances (or other electronic members) in the vertical hole, it can micro-adjust the electronic characteristic of the chip or improve the protection ability of the protection circuit board.
申请公布号 US2008012153(A1) 申请公布日期 2008.01.17
申请号 US20070656990 申请日期 2007.01.24
申请人 DDTIC CORPORATION, LTD. 发明人 CHENG CHIH WEN
分类号 H01L23/28 主分类号 H01L23/28
代理机构 代理人
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