发明名称 APPARATUS AND METHODS RELATING TO ELECTRICALLY CONDUCTIVE PATH INTERFACES DISPOSED WITHIN CAPACITOR PLATE OPENINGS
摘要 A first and second capacitor plate are provided ( 101 and 102 ). Each capacitor plate has an opening disposed therethrough with the second capacitor plate being disposed substantially opposite the first capacitor plate. A first electrically conductive path interface is then disposed ( 103 ) in one of these openings as is at least a second electrically conductive path interface ( 104 ).
申请公布号 US2008013251(A1) 申请公布日期 2008.01.17
申请号 US20060276429 申请日期 2006.02.28
申请人 MOTOROLA, INC. 发明人 TUNGARE AROON V.;ELIACIN MANES;HWANG LIH-TYNG;LEMPKOWSKI ROBERT B.;LIU JUNHUA;SAVIC JOVICA
分类号 H01G4/06 主分类号 H01G4/06
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