摘要 |
The invention relates to the production of optoelectronic components, whereby optical components are applied to the wafer composite. For this purpose, the invention provides a method for producing optoelectronic components, especially image signal-detecting or image signal-transmitting components. According to said method, optical components are made available, picked up and placed on a wafer, the optical components being preferably positioned either one by one or in groups relative to the position of associated optoelectronic or optical components of the wafer or of the wafer to be connected therewith. |
申请人 |
SCHOTT AG;PAWLOWSKI, EDGAR;BIERTUEMPFEL, RALF;WOELFING, BERND;FLEISSNER, FRANK;AUCHTER-KRUMMEL, PETRA;BRAUNECK, ULF;HAYDEN, JOSEPH, S.;FOTHERINGHAM, ULRICH |
发明人 |
PAWLOWSKI, EDGAR;BIERTUEMPFEL, RALF;WOELFING, BERND;FLEISSNER, FRANK;AUCHTER-KRUMMEL, PETRA;BRAUNECK, ULF;HAYDEN, JOSEPH, S.;FOTHERINGHAM, ULRICH |