METHOD OF WAFER THINNING AND SUPPORT PLATE

摘要

A method of wafer thinning for prevention of dimpling. Support plate (1) has a multiplicity of through holes (10). Circuit forming face of wafer (2) is adhered by adhesive member (4) to one major surface of the support plate, and dimple prevention member (3) of 100 µm or more thickness provided at its one face with adhesive layer (30) is stuck to the other major surface of the support plate, so that both end openings of the through holes (10) are closed. While realizing vacuum contact of the support plate via the dimple prevention member to a support table, the non-circuit forming face of the wafer is ground/polished to thereby attain thinning thereof. The dimple prevention member is stripped off, then a solvent is penetrated through the through holes to the adhesive member, and thereafter the wafer is detached from the support plate.