| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve efficiency of taking out light from a semiconductor light-emitting element without requiring additional time during manufacturing, and reducing product yield. <P>SOLUTION: The semiconductor light emitting element comprises a translucent substrate 2; a laminate 6 that is formed on the substrate 2 to include a light emitting layer 4, a p-type semiconductor layer 5, and an n-type semiconductor layer 3; and a plurality of particles 9 that are scattered on the surface of the substrate 2 to have a particle diameter of 1 μm or less. <P>COPYRIGHT: (C)2008,JPO&INPIT |
