| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that a support base composed of a heat-fusible substance is arranged on a container for surely fix a piezoelectric vibrating element in a conventional piezoelectric device, but when the support base is fused by heat, the fused support base material is moved on the surface of space in a depression part or stuck to the surface of the piezoelectric vibrating element, causing instabilization in the vibrating characteristic of the piezoelectric vibrating element and the generation of defects in the piezoelectric device. SOLUTION: In the piezoelectric device, the support base is formed by a thermoplastic substance whose melting temperature is higher than the thermal solidification temperature of a conductive adhesive and the support base is formed so as to be partially inserted into a recess formed in a bottom in the space of the depression part. COPYRIGHT: (C)2008,JPO&INPIT
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