METHOD OF FORMING SEMICONDUCTOR CHIPS, THE SEMICONDUCTOR CHIPS SO FORMED AND CHIP-STACK PACKAGE HAVING THE SAME

摘要

Provided are methods of fabricating semiconductor chips, semiconductor chips formed by the methods, and chip-stack packages having the semiconductor chips. One embodiment specifies a method that includes patterning a scribe line region of a semiconductor substrate to form a semiconductor strut spaced apart from edges of a chip region of the semiconductor substrate.