| 摘要 |
One embodiment relates to an electrical component cooling system that facilitates convectional air flow. The system includes a set of electrical component boards, an inlet, an outlet, and a housing. The electrical component boards each include a plurality of electrical components and are oriented vertically. The inlet is disposed on the housing below the electrical component boards, and the outlet is disposed on the housing above the electrical component boards. The housing substantially encases the electrical component boards and further includes a plenum. The inlet enables ambient air to flow into the plenum disposed within an internal region of the housing. The plenum horizontally directs the air to locations vertically aligned with the regions between the electrical component boards to facilitate convectional air flow in the vertical direction. Heat transfer occurs between the electrical component boards and the air as it flows across the surfaces of the electrical component boards.
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