| 摘要 |
<p>A photo-lithography apparatus and a method of a semiconductor wafer are provided to enhance a yield of a semiconductor device by preventing an error due to a stepped portion during a following process by performing a photo-lithography process after preventing an edge region of the semiconductor wafer from being defocused. A photo-lithography apparatus of a semiconductor wafer includes a leveling measuring device, a leveling compensating device, a control device, and a wafer exposure device. The leveling measuring device measures a tilt of an edge of the semiconductor wafer mounted on a wafer chuck. The leveling compensating device compensates a tilt of a wafer chuck based on a change of the measured tilt. The control device supplies a control signal for performing a photo-lithography process on the edge region according to a result of compensating the tilt. The wafer exposure device performs the photo-lithography process according to the control signal from the control device. Further, the leveling measuring device measures a tile of the edge by measuring a flatness of the semiconductor wafer using a stepper.</p> |
