METHOD OF MANUFACTURING A COMPOSITE OF COPPER AND RESIN

摘要

A method of manufacturing a composite of copper and resin is provided to improve a reliability of a semiconductor substrate by removing an oxidized copper layer under the via-hole. A copper wiring layer is formed to form an inner layer circuit. An insulation layer containing a resin is formed on the wiring layer. A via-hole for exposing a copper surface is formed under the insulation layer. A metal is deposited on the copper surface which is exposed from a bottom of the via-hole. Oxidized copper formed on the exposed copper surface under the via-hole is removed by using a phosphoric acid solution with a pH between 1 and 3. The insulation layer is formed on the copper wiring layer without forming a surface roughening process.