| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip built-in substrate which gives satisfactory manufacturing yield and high reliability in multilayer wirings connected with a built-in semiconductor chip. <P>SOLUTION: The chip built-in substrate is manufactured with a first step of mounting the semiconductor chip 110 on a first substrate whereupon a first wiring is formed, and a second step of bonding a second substrate whereupon a second wiring is formed with the first substrate. In the second step, the semiconductor chip 110 is sealed between the first substrate and the second substrate, the first wiring is electrically connected with the second wiring, and the multilayer wiring connected with the semiconductor chip 110 is formed. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
