| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which, in molding a thin semiconductor package in particular among semiconductor packages, has high fluidity even in high loading of an inorganic filler, suppresses the generation of the wire flow (deformation) and the like upon the molding, and has excellent moldability. <P>SOLUTION: The epoxy resin composition for semiconductor encapsulation contains the following (A)-(D): (A) an epoxy resin; (B) a phenol resin; (C) an inorganic filler; and (D) a silicone compound modified with a polyether in the side chain. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
