| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To manufacture polyimide/metal laminates allowing a decrease in curling tendency and a difficulty in undesirable delamination. <P>SOLUTION: The laminate for electronic application comprises a conductive layer and a multilayer dielectric. The multilayer dielectric has at least three layers comprising i. an adhesive layer, ii. a layer having a low thermal expansion coefficient and iii. a curl balance layer. Alternatively, the laminate can have a second conductive layer bonded to the curl balance layer. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
