发明名称 METHOD FOR PARTITIONING PROCESSING OF RIGID AND BRITTLE MATERIAL PLATE
摘要 <p><P>PROBLEM TO BE SOLVED: To partition accurately along a predetermined line. <P>SOLUTION: In a method for partitioning a plate 10 of a rigid and brittle material, when the incidence of a repeating short optical pulse laser beam 30 with an optically transparent wavelength is performed into the surface 11 of the rigid and brittle material plate 10 through a condenser lens 200 to the rigid and brittle material plate 10 with a thickness t, the focus position of the condenser lens 200 is adjusted so that the waist 31 of the laser beam 30 exists either at a shallower or deeper position than the inner part t/2 of the rigid and brittle material plate body 10, and overlapping incidence of the repeating short optical pulse laser beam 30 into the surface 11 of the rigid and brittle material plate body 10. A process for generating a photo-induced breakage in a region of the waist 31 and in the neighborhood of the back face 12 of the rigid and brittle material plate body 10 separated in the depth direction from the region of the waist 31 is included. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008006652(A) 申请公布日期 2008.01.17
申请号 JP20060178474 申请日期 2006.06.28
申请人 AISIN SEIKI CO LTD 发明人 SASAKI RYUICHIRO
分类号 B28D5/00;B23K26/00;B23K26/06 主分类号 B28D5/00
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