| 摘要 |
A package method for resin coating on a substrate, that especially is applied to seal exposed elements on a substrate of organic medium or multiple medium on a large scale in the low cost and high rate of finished products. It includes single substrate (1), the exposed elements (6) packed with resin on said single substrate and the unattached resin-packing unit (2) formed after packing. The spaces (3) among every unattached resin-packing unit are a certain distance (d) to the absolute displacement and all body stresses of resin of the unattached resin-packing unit and the different thermal expansion coefficient substrate become lower, when multiple exposed elements are packed with unattached resin on single substrate. The resin of the unattached resin-packing unit and the different thermal expansion coefficient substrate are closely connectable after high temperature heating molding. It especially is applied to pack exposed chips on a large scale, has the lower packing costs and high rate of finished products. |
