| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device along with its manufacturing method, a package, and a substrate for mounting a light emitting element, capable of preventing sulphiding on the surface of silver plating applied on an internal lead which is exposed from the inside surface of an opening of a support body of an LED, and capable of preventing degradation in maintenance coefficient of the optical output as time passes. <P>SOLUTION: In a package 1, an internal lead 13a is exposed on a part of the inside surface of an opening of a support body 11 comprising the opening for storing a light emitting element. An external lead 13b which is electrically conductive to the internal lead is led outside the support body, with at least the internal lead being applied with silver plating 14. An LED chip 15 is mounted inside the opening of the support body, and an electrode 15a is electrically connected to the internal lead. A thin film coat 16 for preventing sulphiding of silver plating with film thickness being 1 μm or less is formed to cover at least the silver plating surface of the internal lead, inside the opening of the support body. The thin film coat 16 is provided by injecting the solution of specified resin, and then letting a solvent to evaporate to cure the resin. Further, a translucent resin 17 is embedded to cover at least the thin film coat and the LED chip, inside the opening part of the support body. <P>COPYRIGHT: (C)2008,JPO&INPIT |
