| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board with a cavity portion capable of meeting the need of high density and microscopic physical size of the multilayer printed circuit board, mounting semiconductor devices in a higher density fashion, maintaining the shape of the cavity portion in a good condition where semiconductor devices are mounted, and forming the cavity portion efficiently. <P>SOLUTION: This multilayer printed circuit board is composed of lamination of a plurality of printed circuit board. The printed circuit board is configured to include an insulating base made of thermoplastic resin composition, a conductive pattern arranged on the insulating base, and a via-hole arranged by penetrating the insulating base filled up with conductive paste composition. In addition to a plurality of printed circuit boards forming the lower side of the multilayer printed circuit board, cavity holes are formed in a plurality of printed circuit boards that form the upper layer side. The lamination of the plurality of printed circuit boards is carried out by thermal fusion. In this way, the multilayer printed circuit board with a cavity portion is formed. <P>COPYRIGHT: (C)2008,JPO&INPIT |
