发明名称 THIN FILM DEVICE SUBSTRATE AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a thin-film-device substrate having few occurrence of a substandard thin film pattern and a defective foundation layer, with high yield and reliability; and to provide its manufacturing method. <P>SOLUTION: An insulating film 3 is uniformly adhered so as to cover a plurality of photosensors 2 formed on a glass substrate 1, the foundation layer 4 with three dry film layers 4a, 4b, 4c laminated and formed is arranged on the surface of the insulating film 3 in the predetermined pattern corresponding to the arrangement area of the photosensors 2, and a transparent electrode 5 for electrostatic protection is patterned and overlaid in the predetermined pattern from an arrangement area of the three layer structured foundation layer 4 to its outside area. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008010702(A) 申请公布日期 2008.01.17
申请号 JP20060180760 申请日期 2006.06.30
申请人 CASIO COMPUT CO LTD 发明人 KOSHIZUKA YASUO
分类号 H01L27/146;H01L27/14 主分类号 H01L27/146
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