| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer inspection system in which overall inspection efficiency can be enhanced when inspection of a wafer is performed over a plurality of stages. SOLUTION: For a semiconductor integrated circuit chip formed on a wafer 8, state of an initial mark put on a chip judged as rejectable is imaged by means of a camera 3 based on the results of inspection carried out beforehand at an outsourcing place, and a wafer prober 2 performs inspection of electrical characteristics only of the acceptable chips of wafer 8 upon acquiring data about the initial marking state. When the wafer prober 2 transmits the data about initial marking state and the data of inspection results to a server 5, visual inspection of the wafer 8 is performed; and when a worker performs marking based on the results of visual inspection, state of that marking is imaged by means of a camera 6 and image data is transmitted to the server 5 through a personal computer 7. COPYRIGHT: (C)2008,JPO&INPIT
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