| 摘要 |
PROBLEM TO BE SOLVED: To prevent a dew from being condensed in a peripheral face of a low-temperature thermostatic chamber, in an IC testing device provided with the low-temperature thermostatic chamber. SOLUTION: In the IC testing device covering a portion generating dew condensation in the low-temperature thermostatic chamber with a sealing cover, or provided with the low-temperature thermostatic chamber and a high-temperature thermostatic chamber, heat of the high-temperature thermostatic chamber is distributed to an outer wall face of the low-temperature thermostatic chamber, by a tube piped along an inner wall of the high-temperature thermostatic chamber and an air compressor, or a blower arranged in an upper part of the high-temperature thermostatic chamber, and the dew is thereby prevented from being condensed in the peripheral face of the low-temperature thermostatic chamber. COPYRIGHT: (C)2008,JPO&INPIT
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