发明名称 |
Method of producing group 3 nitride substrate wafers and group 3 nitride substrate wafers |
摘要 |
Quality of one-surface planar processed group 3 nitride wafers depends upon a direction of pasting of wafers on a polishing plate. Low surface roughness and high yield are obtained by pasting a plurality of group 3 nitride as-grown wafers on a polishing plate with OFs or notches facing forward (f), backward (b) or inward (u) with thermoplastic wax having a thickness of 10 mum or less, grinding the as-grown wafers, lapping the ground wafers, polishing the lapped wafers into mirror wafers with a bevel of a horizontal width of 200 mum or less and a vertical depth of 100 mum or less. |
申请公布号 |
US2008014756(A1) |
申请公布日期 |
2008.01.17 |
申请号 |
US20070822903 |
申请日期 |
2007.07.11 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
ISHIBASHI KEIJI;IRIKURA MASATO;NAKAHATA SEIJI |
分类号 |
H01L21/461;B24B37/30;C04B41/91;H01L21/304 |
主分类号 |
H01L21/461 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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