发明名称 Method of producing group 3 nitride substrate wafers and group 3 nitride substrate wafers
摘要 Quality of one-surface planar processed group 3 nitride wafers depends upon a direction of pasting of wafers on a polishing plate. Low surface roughness and high yield are obtained by pasting a plurality of group 3 nitride as-grown wafers on a polishing plate with OFs or notches facing forward (f), backward (b) or inward (u) with thermoplastic wax having a thickness of 10 mum or less, grinding the as-grown wafers, lapping the ground wafers, polishing the lapped wafers into mirror wafers with a bevel of a horizontal width of 200 mum or less and a vertical depth of 100 mum or less.
申请公布号 US2008014756(A1) 申请公布日期 2008.01.17
申请号 US20070822903 申请日期 2007.07.11
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 ISHIBASHI KEIJI;IRIKURA MASATO;NAKAHATA SEIJI
分类号 H01L21/461;B24B37/30;C04B41/91;H01L21/304 主分类号 H01L21/461
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