| 摘要 |
Disclosed herein is a method of manufacturing a printed circuit board using a plasma semi-additive process (PSAP), including: a first plasma-treating step of improving the adhesion of a DFR; a second plasma-treating step of performing descumming and surface-reforming by plasma-treating the surface between pattern walls formed after the first plasma-treating step; a third plasma- treating step of performing descumming and surface-reforming by forming a circuit by plating copper between the plasma-treated pattern walls, removing the pattern walls through a first etching step while copper remains on the substrate, and then plasma-treating the surface of the exposed substrate and the copper- plated surface; and a second etching step of completing an electric circuit by finally etching the plasma-treated substrate. |
