| 摘要 |
A method for ashing a substrate is provided to suppress effectively a popping effect of a photoresist by removing the photoresist after performing a pre-treatment process. A substrate including a photoresist is transferred by a robot in order to be loaded into an inside of a process chamber(S110). A vacuum pump is operated in an airtight state within the process chamber in order to form a vacuum state(S130). A pre-treatment process is performed within the process chamber in order to soften the photoresist formed on the substrate(S150). A main ashing process is performed to remove the softened photoresist from the substrate by using oxygen plasma(S160). An unloading process is performed to unload the substrate from the process chamber in order to finish the ashing process(S170).
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