| 摘要 |
<p>A method for manufacturing an optical device includes the steps of: forming a multilayer film (150), including forming a first mirror (102) above a substrate (101), forming an active layer (103) above the first mirror (102), forming a second mirror (104) above the active layer (103), forming a semiconductor layer (122) on the second mirror (104), and forming a sacrificial layer (60) on the semiconductor layer (122); conducting a reflectance profile examination on the multilayer film (150); patterning the multilayer film (150) to form a surface-emitting laser section (140) having the first mirror (102), the active layer (103) and the second mirror (104), and a diode section (120) having the semiconductor layer (122); and removing at least a portion of the sacrificial layer (60) to expose at least a portion of an upper surface of the semiconductor layer (122), wherein an optical film thickness of the semiconductor layer (122) is formed to be an odd multiple or an even multiple of »/4, where » is a design wavelength of light emitted by the surface-emitting laser section (140), and an optical film thickness of the sacrificial layer (60) is formed not to be an odd multiple or an even multiple of »/4.
Therefore, photoabsorption that is originated from the semiconductor layer (122) occurs in a region that is neither near the Fabry-Perot wavelength (» f ), nor near the two ends of the reflection band (W) of the DBR mirrors. Therefore, the Fabry-Perot wavelength and the reflection band of the first mirror (102) and the second mirror (104) can be accurately measured by a reflectance examination that is conducted once.</p> |
