| 摘要 |
<p>A semiconductor package, a semiconductor module, and a method for manufacturing the semiconductor module are provided to improve a data transfer speed by decreasing a line length between the semiconductor package and an external circuit. A semiconductor package comprises a semiconductor wafer(210), plural conductive pads(220), an insulation film(230), plural connection terminals(240), and a reinforcement member(250). The semiconductor wafer includes first and second surfaces. The conductive pads are arranged in one row on the first surface along an edge of the semiconductor wafer. First sides of the conductive pads are exposed. The insulation film is formed on the conductive pad and the first surface and includes an aperture for exposing a portion of the conductive pad. The connection terminals are arranged on the conductive pad to be electrically connected to the conductive pad. Side portions of the connection terminals are exposed. The reinforcement member is arranged on the insulation film, such that the side portion of the connection terminal is covered.</p> |
