Method of manufacturing a probe card

摘要

The invention relates to methods of making probe card assemblies. According to one aspect of the invention a method of making a probe card assembly comprises: (a) providing a first component of said probe card assembly as a premanufactured component, said first component comprising a substrate (1602) and a first patterned conductive layer on a first surface of said substrate, said first patterned conductive layer comprising a plurality of signal pads (1606a-p) electrically connected to a plurality of terminals (1612e-h) disposed on a second surface of said substrate, and a conductive area (1608) electrically connected to a conductive plane (1616) embedded within said substrate, said plurality of signal pads being electrically insulated from said conductive area and said embedded plane; (b) forming a plurality of contact element pads (2008a-d) on said first electronic component disposed to correspond to locations of test points on a semiconductor device to be tested in accordance with design data regarding said semiconductor device and electrically connected to a first subset of said signal pads; (c) electrically connecting a signal pad from a second set of said signal pads to said conductive area; and (d) adding a plurality of contact elements (2202) for contacting said test points on said semiconductor device to said plurality of contact element pads.